Shared bit line SMT MRAM array with shunting transistors between the bit lines

ABSTRACT

An array of rows and columns of SMT MRAM cells has each of the columns associated with one of its adjacent columns. Each of the SMT MRAM cells of the column is connected to a true data bit line and each of the SMT MRAM cells of the associated pair of columns is connected to a shared complement data bit line. A shunting switch device is connected between each of the true data bit lines and the shared complement data bit line for selectively connecting one of the true data bit lines to the shared complement data bit line to effectively reduce the resistance of the complement data bit line and to eliminate program disturb effects in adjacent non-selected columns of the SMT MRAM cells.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to memory cells and array structures for memory cells. More particularly, this invention relates to magnetic random access memory (MRAM) cells and array structures for spin moment transfer (SMT) MRAM cells.

2. Description of Related Art

The term spin moment transfer MRAM refers to a magnetic tunnel junction (MTJ) random access memory (RAM). In this context, the term “spin” refers to the angular momentum of electrons passing through an MTJ that will alter the magnetic moment of a free layer of an MTJ device. Electrons possess both electric charge and angular momentum (or spin). It is known in the art that a current of spin-polarized electrons can change the magnetic orientation of a free ferromagnetic layer of an MTJ via an exchange of spin angular momentum.

“A Novel Nonvolatile Memory with Spin-torque Transfer Magnetization Switching: Spin-Ram”, Hosomi, et al., IEEE International Electron Devices Meeting, 2005. IEDM Technical Digest. December 2005, pp.: 459-462, provides a nonvolatile memory utilizing spin-torque transfer magnetization switching (STS), abbreviated Spin-RAM. The Spin-RAM is programmed by magnetization reversal through an interaction of a spin momentum-torque-transferred current and a magnetic moment of memory layers in magnetic tunnel junctions (MTJs), and therefore an external magnetic field is unnecessary as that for a conventional MRAM.

A spin-torque MTJ element has two ferromagnetic layers and a spacer layer between the ferromagnetic layers. One ferromagnetic layer is a pinned magnetic layer and the other ferromagnetic layer is a free magnetic layer. The spacer layer is a tunnel barrier layer. When a spin polarized electron flows through the ferromagnetic layers, the spin direction rotates according to the directions of magnetic moment. The rotation of spin direction of the electrons in the ferromagnetic layers is the origin of a spin-torque to the magnetic moment. If the given torque is large enough, magnetization of ferromagnetic layer and thus the magnetic moment is reversed. The magnetization of the ferromagnetic layers transforms from parallel to anti-parallel alignment. This changes the MTJ element from a low resistance state to a high resistance state thus changing the logic state of the MTJ element from a first logic state (0) to a second logic state (1). A voltage source provides the programming voltage that generates the programming current that is reversed appropriately change the programming state of the MTJ element. Reading an SMT MRAM cell involves applying a voltage across the SMT MRAM cell and detecting the resistance (or current) difference.

As illustrated in FIG. 1, a spin moment transfer (SMT) MRAM cell 100 consists of an MTJ element 105 and a Metal Oxide Semiconductor (MOS) gating transistor 110. The MTJ element 105 is composed of a pinned ferromagnetic layer 102 and a free ferromagnetic layer 104, and a tunnel barrier layer 103. The drain of the gating transistor 110 is connected through a nonmagnetic layer to the pinned ferromagnetic layer 102. The free ferromagnetic layer 104 is connected to a bit line 115 and the source of the gating transistor 110 is connected the source line 120. The bit line 115 and source select line 120 are connected to the bipolar write pulse/read bias generator 125. The bipolar write pulse/read bias generator 125 provides the necessary programming current to the MTJ element 105 through the bit line 115 and the source select line 120. The direction being determined by logic state being programmed to the MTJ element 105.

The gate of the gating transistor 110 is connected to a word line 130. The word line 130 transfers a word line select voltage to the gate of the gating transistor 110 to activate the gating transistor 110 for reading or writing the logic state of the MTJ element 105. A sense amplifier 135 has one input terminal connected to the bit line and a second input terminal connected to a voltage reference circuit. When the word line 130 has the word line select voltage activated to turn on the gating transistor 110, the bipolar write pulse/read bias generator 125 generates a bias current that passes through MTJ element 105. A voltage is developed across the MTJ element 105 that is sensed by the sense amplifier 135 and compared with the reference voltage generator to determine the logic state written to the MTJ element 105. This logic state is transferred to the output terminal of the sense amplifier 135 as to the data output signal 145.

Arrays of spin moment transfer (SMT) MRAM cell 100 are arranged in rows and columns. Each row of the spin-transfer based magneto tunnel junction memory devices may have their source line 120 commonly connected to a source line selection circuit or tied to a ground reference point. In other arrangements of an array of SMT MRAM cells 100, as shown in U.S. Patent Application 200/60018057 (Huai), the SMT MRAM cells 100 are organized into an array having two bit lines. The two bit lines are structures such that the current flowing perpendicularly through the MTJ 105 is controlled by the difference of the bias voltages of the two bit lines for each spin moment transfer (SMT) MRAM cell 100. Two reading/writing column selection circuits are provided to control the voltages on the bit lines.

SUMMARY OF THE INVENTION

An object of this invention is to provide an array of SMT MRAM cells with paired columns of the SMT MRAM cells having shared bit lines with means for lowering the resistance of the shared bit lines.

Another object of this invention is inhibiting program disturbance of a non-selected column of a pair of columns of the SMT MRAM cells.

To accomplish at least one of these objects, an array of SMT MRAM cells is arranged in rows and columns. An array of SMT MRAM cells is arranged in rows and columns. Each of the columns of SMT MRAM cells is associated with one of its adjacent columns of SMT MRAM cells. Each column is connected to a true data bit line and each associated pair of columns of SMT MRAM cells is connected to a shared complement data bit line. A shunting switch device is connected between each of the true data bit lines and the shared complement data bit line for selectively connecting one of the true data bit lines to the shared complement data bit line to effectively reduce the resistance of the complement data bit line and to eliminate program disturb effects in adjacent non-selected columns of the SMT MRAM cells. An activation terminal of each of the shunting switch device is connected to a column address decoder such that the shunting switch device is activated to connect the true data bit line associated with the non-selected column in parallel with the complement data bit line. The shared complement data bit line may be wider than the true data bit line to further lower the resistance of the shared complement data bit line. In some embodiments the shared complement data bit line may be twice the dimension of the true data bit line.

In other embodiments, a bit line structure for connecting columns of SMT MRAM cells within an array of SMT MRAM cells has a true data bit line connected to an MTJ device of each SMT MRAM cell of each column of the SMT MRAM cells. A complement data bit line is connected to a source of a gating transistor of each SMT MRAM cell of the each column of the SMT MRAM cells. The bit line structure has a shunting switch transistor connected between the true data bit line and the complement data bit line of the associated pairs of columns of the SMT MRAM cells. The shunting switch transistors have an activation terminal that, when activated, connects the true data bit line of an unselected column of the SMT MRAM cells in parallel with the shared complement data bit line to effectively reduce program disturb effects in the unselected column of SMT MRAM cells. The shared complement data bit line may be wider than the true data bit line to further lower the resistance of the shared complement data bit line. The shared complement data bit line may be twice the dimension of the true data bit line.

In other embodiments, a method for reducing resistance of a shared bit line and reducing program disturb effects of unselected columns of SMT MRAM cells in an array of SMT MRAM cells begins by providing an array of SMT MRAM cells where columns of the SMT MRAM cells are mutually connected to a shared complement data bit line through the source of a gating transistor of each of the SMT MRAM cells of the pair of columns of SMT MRAM cells. The shared complement data bit line may be wider than the true data bit line to further lower the resistance of the shared complement data bit line. In some embodiments the shared complement data bit line may be twice the dimension of the true data bit line.

Each of the SMT MRAM cells of each column of the SMT MRAM cells is connected to a true data bit line through an MTJ device within the SMT MRAM cells. A source of a gating transistor of the pair of adjacent columns of SMT MRAM cells is connected to a complement data bit line. A shunting switch transistor is connected between the true data bit line and the complement data bit line of the associated pairs of columns of the SMT MRAM cells. During a program operation, an address is decoded to select a row and columns of the array of SMT MRAM cells. An activation terminal of each of the shunting switch transistor of each unselected column of the array of SMT MRAM cells is initiated to turn on the shunting switch transistors to connect the true data bit line of the unselected column of the SMT MRAM cells in parallel with the shared complement data bit line to effectively reduce program disturb effects in the unselected column of SMT MRAM cells. The programming drive current is then activated to program the selected SMT MRAM cells of the selected rows and columns.

Further, in other embodiments, an array of SMT MRAM cells is arranged in rows and columns. Each of the columns of SMT MRAM cells is associated with one of its adjacent columns of SMT MRAM cells. Each column is connected to a true data bit line and to a complement data bit line.

A shunting switch device is connected between the true data bit line and the complement data bit line of the connected columns of SMT MRAM cells for selectively connecting one of the true data bit lines to the complement data bit line to effectively reduce the resistance of the complement data bit line and to eliminate program disturb effects in adjacent non-selected columns of the SMT MRAM cells. The complement data bit lines are connected such that they are shared during a program operation to further reduce the resistance of the complement data bit lines. An activation terminal of each of the shunting switch devices is connected to a column address decoder such that the shunting switch device is activated to connect the true data bit line associated with the non-selected column in parallel with the complement data bit line.

Still further, in other embodiments, an array of SMT MRAM cells is arranged in rows and columns. Each of the columns of SMT MRAM cells is associated with one of its adjacent columns of SMT MRAM cells. Each column is connected to a true data bit line and to a complement data bit line. At least one true data bit line shunting switch device is connected between the true data bit line and the complement data bit line of the connected columns of SMT MRAM cells for selectively connecting one of the true data bit lines to the complement data bit line. The complement data bit lines of the associated adjacent columns have at least one complement data bit line shunting switch device connected between the adjacent complement data bit lines such that they are shared during a program operation to further reduce the resistance of the complement data bit lines. An activation terminal of each of the shunting switch devices is connected to a column address decoder such that the shunting switch device is activated to connect the two complement data bit lines and the true data bit line associated with the non-selected column in parallel to effectively reduce the resistance of the complement data bit line and to eliminate program disturb effects in adjacent non-selected columns of the SMT MRAM cells.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a functional diagram of a SMT MRAM memory cell and its peripheral circuitry of the prior art.

FIG. 2 is a functional diagram of a SMT MRAM memory cell and its peripheral circuitry.

FIG. 3 is a schematic diagram of an embodiment of an array of SMT MRAM memory cells.

FIG. 4 is block diagram of an embodiment of an SMT MRAM memory device.

FIG. 5 is a flow diagram for a method to effectively reduce program disturb effects in the unselected column of SMT MRAM cells.

FIG. 6 is a schematic diagram of another embodiment of an array of SMT MRAM memory cells having shunting switch transistors.

FIG. 7 is a schematic diagram of still another embodiment of an array of SMT MRAM memory cells having shunting switch transistors.

DETAILED DESCRIPTION OF THE INVENTION

The embodiments of SMT MRAM cell arrays have columns of SMT MRAM memory cells with pairs of bit lines, for the sake of convention, have one of the bit line referred to as a true data bit line and the other bit line referred to as the complement data bit line. In the prior art, as described in Huai, FIG. 9, each column of cells has a pair of bit lines. Such architecture has too many bit lines and the bit line connecting to the source sides of gating transistor 110 of FIG. 2 is highly resistive. High bit line resistance puts constraint on how many cells that may be grouped in a basic array with decoders and drivers. In embodiments of this invention, adjacent pairs of columns are connected to share a bit the complement data bit lines. The complement data bit lines are effectively merged to form the complement data bit lines. Therefore, in some embodiments, the complement data bit lines are formed to be much wider and therefore less resistive. This permits a larger and more efficient array in terms of area. However, in the shared complement data bit line structure, the adjacent SMT MRAM memory cell of an SMT MRAM memory cell being programmed will be disturbed during programming. To effectively reduce program disturb effects in the unselected column of SMT MRAM cells, shunting switch transistors are added between each of the true data bit lines and the shared complement data bit lines.

Referring to FIG. 2, the structure of the SMT MRAM memory cell is essentially identical to that of FIG. 1, except the source of the gating transistor 110 of the SMT MRAM memory cell 100 is connected to the shared complement data bit line 155. In the embodiments, the complement data bit line 155 is structured to be in parallel with the true data bit line 150. The true data bit line 150 is connected to the free ferromagnetic layer 104 of the MTJ element 105. The true data bit line 150 and the complement data bit line 155 are connected to THE bipolar write pulse/read bias generator 125. The complement data bit line 155 is shared with an identical SMT MRAM memory cell 100 in an adjacent column of SMT MRAM memory cells 100.

The complement data bit line 155 that is connected to the source of the gating transistor 110, is the first metal layer line in the physical construction of the SMT MRAM memory cell 100. The true data bit line 150 is the last, or the top most metal line in the physical cell stack. The first metal bit line of the complement data bit line 155 has to share the space with vias connecting the drain side of the gating transistor 110 to the bottom plate 102 of MTJ element 105 thus forcing the first metal bit line of the complement data bit line 155 usually to be thinner. The first metal bit line of the complement data bit line 155 being narrower and thinner are therefore much more resistive than the top true data bit line 150. By sharing two adjacent complement data bit lines 155, the width of shared line is effectively wider by three times—two lines plus the spacing between the two adjacent complement data bit lines 155. The disadvantage of doing so is that the SMT MRAM memory cell 100 adjacent to the cell being programmed will see a disturb condition because they share the same selected word line 130. The shunting transistor (or transistors if we put more than one between the bit lines true and complement) will help to reduce this disturb condition. The further reduction in resistance of the two adjacent complement data bit lines 155 comes from the neighboring true bit line 150 is also in parallel with the complement bit line 155. But this requires more than one shunting transistor between the true and complement bit lines.

FIG. 3 illustrates an embodiment of an array 200 of the SMT MRAM memory cells 100. The SMT MRAM memory cells 100 are arranged into rows and columns to form the array 200. The MTJ element of each SMT MRAM memory cells 100 is connected to one of the true data bit lines 250 a, 259 b, . . . 250 n.

Adjacent columns of SMT MRAM memory cells 100 are associated with each other. A shunting switch transistor 205 a, . . . , 205 n and 206 a, . . . , 206 n connects each true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n to its associated shared complement data bit line 255 a, . . . , 255 n. A first source/drain of each of the shunting switch transistor 205 a, . . . , 205 n and 206 a, . . . , 206 n is connected to the true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n. The second source/drain of each of the shunting switch transistor 205 a, . . . , 205 n and 206 a, . . . , 206 n is connected to one shared complement data bit line 255 a, . . . , 255 n. The gate of each of the shunting switch transistors 205 a, . . . , 205 n is connected to the in-phase column address select bit Ay 210 and the gate of each of the shunting switch transistor 206 a, . . . , 206 n is connected to the out-of-phase column address select bit Ay 212. The in-phase column address select bit Ay and the out-of-phase column address select bit Ay 212 originate from a column or bit line decoder selector that decodes an address to select the columns of the array 200 for programming, reading, and erasing.

Each of the true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n is connected to a first source/drain of a true data bit line switch transistor 215 a, 215 b, . . . , 215 n-1, 215 n. The second source/drain of each of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n is connected to a true program data voltage distribution line 247. Each shared complement data bit line 255 a, . . . , 255 n is connected to a first source/drain of each of the complement data bit line switch transistors 220 a, . . . , 220 n. The second source/drain of each of the complement data bit line switch transistors 220 a, . . . , 220 n is connected to a complement data program voltage distribution line 245. The gates of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n are connected to the bit line decode select circuit 227. The decode select circuit 225 receives an address, decodes the address and activates the appropriate gate of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n to activate the selected column or columns for programming, erasing, and reading the selected SMT MRAM memory cells 100.

Each of the complement data bit lines 255 a, 255 b, 255 n-1, . . . , 255 n is connected to a first source/drain of a complement data bit line switch transistor 220 a, 220 b, . . . , 220 n-1, 220 n. The second source/drain of each of the complement data bit line switch transistors 220 a, 220 b, . . . , 220 n-1, 220 n is connected to a program voltage distribution line 245. Each shared complement data bit line 255 a, . . . , 255 n is connected to a first source/drain of each of the complement data bit line switch transistors 220 a, . . . , 220 n. The second source/drain of each of the complement data bit line switch transistors 220 a, . . . , 220 n is connected to a program voltage distribution line 245. The gates of the complement data bit line switch transistors 220 a, 220 b, . . . , 220 n-1, 220 n are connected to the bit line decode select circuit 225. As above, the decode select circuit 225 receives an address, decodes the address and activates the appropriate gate of the complement data bit line switch transistors 220 a, 220 b, . . . , 220 n-1, 220 n to activate the selected column or columns for programming, erasing, and reading the selected SMT MRAM memory cells 100.

During programming of selected SMT MRAM memory cells 100, the shunting switch transistors 205 a, . . . , 205 n are activated to effectively place unselected true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n in parallel with the shared complement data bit line 255 a, . . . , 255 n for each paired columns of the SMT MRAM memory cells 100. By placing the true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n in parallel with the shared complement data bit line 255 a, . . . , 255 n, the resistance of the shared complement data bit line 255 a, . . . , 255 n is effectively decreased and prevents disturb program currents from passing through the unselected SMT MRAM cells 100.

FIG. 4 is block diagram of an embodiment of an SMT MRAM memory device showing a shared bit line structure with shunting switch transistors between the true data bit lines and the shared complement data bit lines. The SMT MRAM memory device has an array of SMT MRAM memory cells 100 that is formed of multiple sub-arrays 200 of SMT MRAM memory cells 100. The SMT MRAM memory cells 100 are formed in rows and columns with the structure as described in FIG. 2. With each row of the SMT MRAM memory cells 100 are connected to one of the word lines 315 a, . . . , 315 m, 316 a, . . . , 316 m. Each column of the SMT MRAM memory cells 100 is connected to one of the true data bit lines 320 a, 320 b, . . . , 320 n-1, 320 n, 321 a, 321 b, . . . , 321 n-1, 321 n, and 322 a, 322 b, 322 n-1, 322 n. Adjacent columns are paired and connected to one of the shared complement data bit line 325 a, . . . , 325 m, 326 a, . . . , 326 m, and 327 a, . . . , 327 m. The true data bit lines 320 a, 320 b, . . . , 320 n-1, 320 n, 321 a, 321 b, . . . , 321 n-1, 321 n, and 322 a, 322 b, . . . , 322 n-1, 322 n are connected to their associated shared complement data bit line 325 a, . . . , 325 m, 326 a, . . . , 326 m, and 327 a, . . . , 327 m through their respective shunting switch transistors 205 and 206 to selectively connected the true data bit lines 320 a, 320 b, . . . , 320 n-1, 320 n, 321 a, 321 b, . . . , 321 n-1, 321 n, and 322 a, 322 b, . . . , 322 n-1, 322 n of the unselected column of SMT MRAM memory cells 100 to the associated shared complement data bit line 325 a, . . . , 325 m, 326 a, . . . , 326 m, and 327 a, . . . , 327 m as described above.

The true data bit lines 320 a, 320 b, . . . , 320 n-1, 320 n, 321 a, 321 b, . . . , 321 n-1, 321 n, and 322 a, 322 b, . . . , 322 n-1, 322 n are connected to the bit line decode selector circuit 305 a. The shared complement data bit line 325 a, . . . , 325 m, 326 a, . . . , 326 m, and 327 a, . . . , 327 m are connected to the bit line decode selector circuit 305 b The bit line decode selector circuits 305 a and 305 b are connected to the bit line decode circuit 355 The bit line decode circuit receives the external address lines 365 and the external control lines 360 and decodes the decoded address 370 and transmits the decoded address 370 to the bit line decode selector circuits 305 a and 305 b to select the desired columns of selected sub-arrays 200 of the SMT MRAM memory cells 100.

The write/read generator 335 receives the clock timing signal 345 and the data input signal 350 and conditions and amplifies the data input signal 350 to form the true program data D_(w) 375 and the complement data program 376. The true program data D_(w) 375 and the complement data program D_(w) 376 are transferred respectively through the bit line decode selector circuits 305 a and 305 b to the appropriate true data bit lines 320 a, 320 b, . . . , 320 n-1, 320 n, 321 a, 321 b, . . . , 321 n-1, 321 n, and 322 a, 322 b, . . . , 322 n-1, 322 n and the shared complement data bit lines 325 a, . . . , 325 m, 326 a, . . . , 326 m, and 327 a, . . . , 327 m.

During a programming operation, the shunting switch transistors 205 and 206 of the unselected columns are activated to shunt the true data bit lines 320 a, 320 b, . . . , 320 n-1, 320 n, 321 a, 321 b, . . . , 321 n-1, 321 n, and 322 a, 322 b, . . . , 322 n-1, 322 n of the unselected columns to shared complement data bit lines 325 a, . . . , 325 m, 326 a, . . . , 326 m, and 327 a, . . . , 327 m to prevent disturb program currents from passing through the unselected SMT MRAM cells 100 and to further decrease the effective resistance of the complement data bit lines 325 a, . . . , 325 m, 326 a, . . . , 326 m, and 327 a, . . . , 327m.

During a read operation, a read current is passed from the bit line decode selector 305 a through the selected true data bit lines 320 a, 320 b, . . . , 320 n-1, 320 n, 321 a, 321 b, . . . , 321 n-1, 321 n, and 322 a, 322 b, . . . , 322 n-1, 322 n to the MTJ of the SMT MRAM memory cells 100 to the shared complement data bit line 325 a, . . . , 325 m, 326 a, . . . , 326 m, and 327 a, . . . , 327 m to the bit line decode selector 305 b. The sense amplifiers are connected to the through the bit line decode selector 305 a to sense the voltage developed across the MTJ of the selected SMT MRAM memory cells 100 to detect the data stored in the selected SMT MRAM 100. The data driver 385 receives the captured data conditions and amplifies the data to generate the output data 390 that is transferred to external circuitry.

Refer now to FIG. 5 for a discussion of an embodiment of a method to reduce the resistance of a complement data bit line during a programming operation and to effectively reduce program disturb effects in unselected columns of SMT MRAM memory cells. A provided array of SMT MRAM memory cells is structured and operates as described in FIG. 3 where columns of the SMT MRAM cells are mutually connected to a shared complement data bit line through the source of a gating transistor of each of the SMT MRAM cells of the pair of columns of SMT MRAM cells. Each of the SMT MRAM cells of each column of the SMT MRAM cells is connected to a true data bit line. Each of the true data bit lines is connected to an MTJ device within the SMT MRAM cells. A source of a gating transistor of the pair of adjacent columns of SMT MRAM cells is connected to a complement data bit line. A shunting switch transistor is connected between the true data bit line and the complement data bit line of the associated pairs of columns of the SMT MRAM cells. During a program operation, an address is decoded (Box 400) to select a row (Box 405) and columns (Box 410) of the array of SMT MRAM cells. A gating terminal of each of the shunting switch transistor of each unselected column of the array of SMT MRAM cells is activated (Box 415) to turn on the shunting switch transistors to connect the true data bit line of the unselected columns of the SMT MRAM cells in parallel with the shared complement data bit line to effectively reduce program disturb effects in the unselected column of SMT MRAM cells. The programming drive current is then activated (Box 420) to program the selected SMT MRAM cells of the selected rows and columns.

FIG. 6 illustrates an alternate embodiment of an array 200 of the SMT MRAM memory cells 100. The SMT MRAM memory cells 100 are arranged into rows and columns to form the array 200 as described above in FIG. 3. The MTJ element of each SMT MRAM memory cells 100 is connected to one of the true data bit lines 250 a, 259 b, . . . , 250 n and to one of the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n.

Adjacent columns of SMT MRAM memory cells 100 are associated with each other. A shunting switch transistor 505 a, . . . , 505 n and 506 a, . . . , 506 n connects each true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n to its associated complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n. A first source/drain of each of the shunting switch transistors 505 a, . . . , 505 n and 506 a, . . . , 506 n is connected to the true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n. The second source/drain of each of the shunting switch transistors 505 a, . . . , 505 n and 506 a, . . . , 506 n is connected to one associated complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n. The gate of each of the shunting switch transistors 505 a, . . . , 505 n is connected to the in-phase column address select bit Ay 210 and the gate of each of the shunting switch transistor 506 a, . . . , 506 n is connected to the out-of-phase column address select bit Ay 212. The in-phase column address select bit Ay and the out-of-phase column address select bit Ay 212 originate from a column or bit line decoder selector that decodes an address to select the columns of the array 200 for programming, reading, and erasing.

Each of the true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n is connected to a first source/drain of a true data bit line switch transistor 215 a, 215 b, . . . , 215 n-1, 215 n. The second source/drain of each of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n is connected to a true program data voltage distribution line 247. Each shared complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n is connected to a first source/drain of each of the complement data bit line switch transistors 220 a, . . . , 215 n. The second source/drain of each of the complement data bit line switch transistors 220 a, . . . , 215 n is connected to a complement data program voltage distribution line 245. The gates of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n are connected to the bit line decode select circuit 225. The decode select circuit 225 receives an address, decodes the address and activates the appropriate gate of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n to activate the selected column or columns for programming, erasing, and reading the selected SMT MRAM memory cells 100.

Each of the complement data bit lines 500 a, . . . , 500 n is connected to a first source/drain of a complement data bit line switch transistor 520 a, . . . , 520 n and each of the complement data bit lines 501 a, . . . , 501 n is connected to the first source/drain of a complement data bit line switch transistors 521 a, . . . , 521 n. The second source/drain of each of the complement data bit line switch transistors 520 a, . . . , 520 n and 521 a, . . . , 521 n is connected to a program voltage distribution line 245. The gates of the complement data bit line switch transistors 520 a, . . . , 520 n and 521 a, . . . , 521 n are connected to the bit line decode select circuit 225. As above, the decode select circuit 225 receives an address, decodes the address and activates the appropriate gate of the complement data bit line switch transistors 520 a, . . . , 520 n and 521 a, . . . , 521 n to activate the selected column or columns for programming, erasing, and reading the selected SMT MRAM memory cells 100.

During programming of selected SMT MRAM memory cells 100, the shunting switch transistors 505 a, . . . , 505 n and 506 a, . . . , 506 n are selectively activated to effectively place unselected true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n in parallel with their associated complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n for each of the columns of the SMT MRAM memory cells 100. By placing the true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n in parallel with the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n, the resistance of the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n is effectively decreased and prevents disturb program currents from passing through the unselected SMT MRAM cells 100. Further during programming. the complement data bit line switch transistors 520 a, . . . , 520 n and 521 a, . . . , 521 n of the unselected columns are activated to effectively place the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n of the selected column in parallel with the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n of the associated adjacent unselected column of the SMT MRAM memory cells 100. The placing the complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n of the associated adjacent selected and unselected bit lines in parallel effectively reduces the resistance of the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n of the selected columns of SMT MRAM memory cells 100 and any magnetic field resulting in a program disturb of the unselected SMT MRAM memory cells 100 is mitigated.

The bit line decode selector circuit 225 must be structured to activate the complement data bit line switch transistors 520 a, . . . , 520 n and 521 a, . . . , 521 n appropriately for the unselected complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n to connected selected and unselected complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n in parallel. The bit line decode selector circuit 225 must further deactivate the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n for the unselected true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n to prevent the true program data voltage distribution line 247 from being applied to the unselected true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n and thus to the selected and unselected complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n.

FIG. 7 illustrates a generalized embodiment of an array 200 of the SMT MRAM memory cells 100. The SMT MRAM memory cells 100 are arranged into rows and columns to form the array 200 as described above in FIGS. 3 and 6. The MTJ element of each SMT MRAM memory cells 100 is connected to one of the true data bit lines 250 a, 259 b, . . . , 250 n and to one of the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n.

Adjacent columns of SMT MRAM memory cells 100 are associated with each other. A shunting switch transistor 600 a, . . . , 600 n, 601 a, . . . , 601 n, 605 a, . . . , 605 n and 606 a, . . . , 606 n connects each true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n to its associated complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n. A first source/drain of each of the shunting switch transistors 600 a, . . . , 600 n, 601 a, . . . , 601 n, 605 a, . . . , 605 n and 606 a, . . . , 606 n is connected to one of the true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n. The second source/drain of each of the shunting switch transistors 600 a, . . . , 600 n, 601 a, . . . , 601 n, 605 a, . . . , 605 n and 606 a, . . . , 606 n is connected to one associated complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n. The gate of each of the shunting switch transistors 600 a, . . . , 600 n, and 605 a, . . . , 605 n is connected to the in-phase column address select bit Ay 620 a and 620 b and the gate of each of the shunting switch transistor 601 a, . . . , 601 n and 606 a, . . . , 606 n is connected to the out-of-phase column address select bit Ay 621 a and 621 b. The in-phase column address select bit Ay 620 a and 620 b and the out-of-phase column address select bit Ay 621 a and 621 b originate from a column or bit line decoder selector that decodes an address to select the columns of the array 200 for programming, reading, and erasing. In the generalized embodiment there may be an number of the shunting switch transistors 600 a, . . . , 600 n, 601 a, . . . , 601 n, 605 a, . . . , 605 n and 606 a, . . . , 606 n placed in parallel between the true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n and their associated complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n with two of the shunting switch transistors 600 a, . . . , 600 n, 601 a, . . . , 601 n, 605 a, . . . , 605 n and 606 a, . . . , 606 n connected between each of the true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n and their associated complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n.

Each of the complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n of the associated columns of SMT MRAM's 100 has a pair of complement bit line shunting transistors 615 a, . . . , 615 n and 616 a, . . . , 616 n. Again as described above, in the generalized embodiment, the number of complement bit line shunting transistors 615 a, . . . , 615 n and 616 a, . . . , 616 n may be any number to assist in reducing the resistance of the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n, with the two of this illustration being exemplary. A first source/drain of the complement bit line shunting transistors 615 a, . . . , 615 n and 616 a, . . . , 616 n is connected to a first of the complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n and a second source/drain of the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n being connected to a second of the associated complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n. The gates of the complement bit line shunting transistors 615 a, . . . , 615 n and 616 a, . . . , 616 n are connected to a program command signal to activate the connection of the associated complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n through the complement bit line shunting transistors 615 a, . . . , 615 n and 616 a, . . . , 616 n during a program operation and to disconnect the complement bit line shunting transistors 615 a, . . . , 615 n and 616 a, . . . , 616 n during read and erase operations.

As shown in FIG. 6, each of the true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n is connected to a first source/drain of a true data bit line switch transistor 215 a, 215 b, . . . , 215 n-1, 215 n. The second source/drain of each of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n is connected to a true program data voltage distribution line 247. Each shared complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n is connected to a first source/drain of each of the complement data bit line switch transistors 220 a, . . . , 215 n. The second source/drain of each of the complement data bit line switch transistors 220 a, . . . , 215 n is connected to a complement data program voltage distribution line 245. The gates of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n are connected to the bit line decode select circuit 225. The decode select circuit 225 receives an address, decodes the address and activates the appropriate gate of the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n to activate the selected column or columns for programming, erasing, and reading the selected SMT MRAM memory cells 100.

Further, as shown in FIG. 6, each of the complement data bit lines 500 a, . . . , 500 n is connected to a first source/drain of a complement data bit line switch transistor 520 a, . . . , 520 n and each of the complement data bit lines 501 a, . . . , 501 n is connected to the first source/drain of a complement data bit line switch transistors 521 a, . . . , 521 n. The second source/drain of each of the complement data bit line switch transistors 520 a, . . . , 520 n and 521 a, . . . , 521 n is connected to a program voltage distribution line 245. The gates of the complement data bit line switch transistors 220 a, 220 b, . . . , 220 n-1, 220 n are connected to the bit line decode select circuit 225. As above, the decode select circuit 225 receives an address, decodes the address and activates the appropriate gate of the complement data bit line switch transistors 2 520 a, . . . , 520 n and 521 a, . . . , 521 n to activate the selected column or columns for programming, erasing, and reading the selected SMT MRAM memory cells 100.

During programming of selected SMT MRAM memory cells 100, the in-phase column address select bit Ay 620 a and 620 b and the out-of-phase column address select bit Ay 621 a and 621 b are selectively activated to turn on the selected shunting switch transistors 600 a, . . . , 600 n, 601 a, . . . , 601 n, 605 a, . . . , 605 n and 606 a, . . . , 606 n to effectively place unselected true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n in parallel with their associated complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n for each of the columns of the SMT MRAM memory cells 100. The Program command signals 625 a and 625 b are activated to turn on the selected complement bit line shunting transistors 615 a, . . . , 615 n and 616 a, . . . , 616 n place the complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n of the associated column pairs of the SMT MRAM memory cells 100 in parallel to further reduce the resistance of the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n.

By placing the true data bit line 250 a, 250 b, . . . , 250 n-1, 250 n in parallel with the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n, the resistance of the complement data bit line 500 a, . . . , 500 n and 501 a, . . . , 501 n is effectively decreased and any magnetic field resulting in a program disturb of the unselected SMT MRAM memory cells 100 is mitigated.

The bit line decode selector circuit 225 must deactivate the true data bit line switch transistors 215 a, 215 b, . . . , 215 n-1, 215 n for the unselected true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n to prevent the true program data voltage distribution line 247 from being applied to the unselected true data bit lines 250 a, 250 b, . . . , 250 n-1, 250 n and thus to the selected and unselected complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n.

The placing of the shunting switch transistors 600 a, . . . , 600 n, 601 a, . . . , 601 n, 605 a, . . . , 605 n and 606 a, . . . , 606 n and the complement bit line shunting transistors 615 a, . . . , 615 n and 616 a, . . . , 616 n in the various locations through out the array 200 of SMT MRAM memory cells 100 of FIGS. 3, 4, 6, and 7 as stated above decreases the resistance of the complement data bit lines 500 a, . . . , 500 n and 501 a, . . . , 501 n, therefore a larger and more efficient array in terms of area is now formed.

While this invention has been particularly shown and described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the invention. 

1. An array of SMT MRAM cells comprising: paired columns of the SMT MRAM cells; a plurality of first type bit lines, wherein each of the first type bit lines are connected to a terminal of an MTJ device of each of the SMT MRAM cells on one column of the SMT MRAM cells; a plurality of second type bit lines, wherein each of the second type bit lines is connected to a source terminal of a gating device of each of the SMT MRAM cells on one column; and means for connecting the first type bit lines with the second type bit lines of the same column to inhibit program disturbance of an unselected column of the pair of columns of the SMT MRAM cells.
 2. The array of SMT MRAM cells of claim 1 wherein each of the second type bit lines is connected to of the adjacent columns of SMT MRAM cells.
 3. The array of SMT MRAM cells of claim 2 wherein the second type bit lines are constructed to have a width that is sufficiently wide to reduce a resistance of the second type bit line such that the array of SMT MRAM cells is larger and is more efficiently in terms of area.
 4. The array of SMT MRAM cells of claim 3 wherein the width of the second type bit line is twice the width of the first type bit line.
 5. The array of SMT MRAM cells of claim 1 wherein each of the columns of the SMT MRAM cells are connected to one adjacent second type bit lines of the plurality of the second type bit lines.
 6. The array of SMT MRAM cells of claim 5 further comprising means for connecting the two adjacent second type bit lines in parallel to merge the two adjacent second type bit lines to appear much wider and therefore less resistive to permit a larger and more area efficient array of SMT MRAM cells.
 7. The array of SMT MRAM cells of claim 1 wherein the first type bit line is a true data bit line and the second type bit line is a complement data bit line.
 8. An SMT MRAM device comprising: SMT MRAM memory cells arranged in an array of rows and columns such that each of the columns of SMT MRAM cells is associated with one of its adjacent columns of SMT MRAM cells. a plurality of true data bit lines where each of the true data bit lines is connected to one adjacent column; a plurality of complement data bit lines, wherein each of the plurality of complement data bit lines are connected with each SMT MRAM cell of a pair of columns of the SMT MRAM cells such that each of the plurality of complement data bit lines is shared with the pair of columns of the SMT MRAM cells; and a plurality of shunting switch devices, wherein each of the shunting switch devices is connected between one of the true data bit lines and the shared complement data bit line for selectively connecting one of the true data bit lines to the shared complement data bit line to effectively reduce the resistance of the complement data bit line and to eliminate program disturb effects in adjacent non-selected columns of the SMT MRAM cells.
 9. The SMT MRAM device of claim 8 further comprising a column address decoder in communication with an activation terminal of each of the shunting switch devices such that the shunting switch device is activated to connect the true data bit line associated with the non-selected column in parallel with the complement data bit line.
 10. The SMT MRAM device of claim 8 wherein the shared complement data bit line is wider than the true data bit line to further lower the resistance of the shared complement data bit line.
 11. The SMT MRAM device of claim 10 wherein the shared complement data bit line is twice the dimension of the true data bit line.
 12. A bit line structure for connecting columns of SMT MRAM cells within an array of SMT MRAM cells arranged in rows and columns comprising a true data bit line connected to an MTJ device of each SMT MRAM cell of a column of the SMT MRAM cells a complement data bit line connected to a source of a gating transistor of each SMT MRAM cell of a pair of associated columns of the SMT MRAM cells. at least one shunting switch transistor connected between the true data bit line and the complement data bit line of the associated pair of columns of the SMT MRAM cells such that the at least one shunting switch transistor has an activation terminal that, when activated, connects the true data bit line of an unselected column of the SMT MRAM cells in parallel with the shared complement data bit line to effectively reduce program disturb effects in the unselected column of SMT MRAM cells.
 13. The bit line structure of claim 12 wherein the shared complement data bit line is wider than the true data bit line to further lower the resistance of the shared complement data bit line.
 14. The bit line structure of claim 13 wherein the shared complement data bit line may be twice the dimension of the true data bit line.
 15. A method for reducing resistance of a shared complement bit line and reducing program disturb effects of unselected columns of SMT MRAM cells in a programming operation in an array of SMT MRAM cells comprising; providing an array of rows and columns of SMT MRAM cells wherein pairs of columns of the SMT MRAM cells are each mutually connected to one shared complement data bit line through the source of a gating transistor of each of the SMT MRAM cells of the pair of columns of SMT MRAM cells and each of the SMT MRAM cells of each column of the SMT MRAM cells is connected to one true data bit line, and a shunting switch transistor is connected between the true data bit line and the complement data bit line of the associated pairs of columns of the SMT MRAM cells; decoding an address to select one row and at least one column of the array of SMT MRAM cells; initiating an activation terminal of each of the shunting switch transistor of each unselected column of the array of SMT MRAM cells to turn on the shunting switch transistors to connect the true data bit line of the unselected column of the SMT MRAM cells in parallel with the shared complement data bit line to effectively reduce program disturb effects in the unselected column of SMT MRAM cells. activating a programming drive current to program the selected SMT MRAM cells of the selected rows and columns.
 16. The method of claim 15 wherein each of the true data bit lines is connected to an MTJ device within the SMT MRAM cells and a source of a gating transistor of the pair of adjacent columns of SMT MRAM cells is connected to a complement data bit line.
 17. The method of claim 15 wherein each of the columns of SMT MRAM cells is associated with one of its adjacent columns of SMT MRAM cells. Each column is connected to a true data bit line and to a complement data bit line.
 18. An SMT MRAM memory device comprising: array of rows and columns of SMT MRAM cells wherein Each of the columns of SMT MRAM cells is associated with one of its adjacent columns of SMT MRAM cells; a plurality of true data bit lines, wherein each of the true data bit lines is connected to each of the SMT MRAM cells of one of the columns of SMT MRAM cells; a plurality of complement data bit lines, wherein each complement data bit line is associated with one of the true data bit lines and connected each of the SMT MRAM cells connected to its associated true data bit line; a plurality of true data bit line shunting switch devices, wherein at least one true data bit line shunting switch devices is connected between the true data bit line and the complement data bit line of the connected columns of SMT MRAM cells for selectively connecting one of the true data bit lines to its associated complement data bit line of a non-selected column in parallel to effectively to eliminate program disturb effects in adjacent non-selected columns of the SMT MRAM cells.
 19. The SMT MRAM memory device of claim 18 further comprising a plurality of complement data bit line shunting switch devices connected between two complement data bit lines of adjacent columns of SMT MRAM cells to selectively connect the two complement data bit lines of the adjacent columns together in parallel to merge the two adjacent complement data bit lines to appear as single much wider complement data bit line that is less resistive to permit a larger and more area efficient array of SMT MRAM cells. 